SiliconOne Mechanical Packaging Engineer

The application window is expected to close on: 02/28/2025.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Who We Are

Cisco Silicon One is a business organization building and selling ASICs inside and outside of Cisco. We have a long track record of building large, high-performance Silicon ASICs for Cisco?s internal platforms and external customers. We are a specialized ASIC team with experts in all aspects of Silicon Design and system integration. Our substrates are using the latest fanout technologies for large scale integration. We are focused on all the latest technologies including optical and advanced packaging.

What You'll Do

Cisco SiliconOne ASIC team is looking for an expert in advanced silicon substrate mechanical analysis to help us develop our next generation silicon and platforms. You will have advanced experience with co-simulation of silicon ASIC, interposer technologies, package substrate and PCB. You will be involved in substrate material development and SMT attach strategies and involved in multiple aspects of substrate planning and layout to make new silicon products successful. You will develop advanced packages utilizing new fanout technologies using new materials. You will lead thermal-mechanical analysis for preferred package and board attach and explore optimizations. You will extend a track record of leading similar products to first pass success by minimizing package design iterations.

Responsibilities:

Setup models, integrating materials from PCB, BGA, substrate, bump, interposer, ASIC and all thermal attach solutions for large pin count devices

Firm grasp of material science and the impact on substrate and final assembly.

Work with complex assemblies with HBM and chiplets

Understand and simulate the impact at different temperatures, especially SMT attach.

Work with thermal modeling team to review models and simulations and impact on mechanical behavior

Understand the complexities of qualification and challenges of bump and BGA placement

Collaborate with package, system, and product operations teams to build a product.

Focus will be primarily on flip chip packages and heterogeneous integration of chip package design

Understand and drive towards milestones to make development successful

Contribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammates

Who You Are

You are a mechanical engineer with substrate expertise working on cutting-edge technologies and developing substrates that push the boundaries on power, integration, and fabrication/assembly technology. The scope of package development is industry leading. You will be working on and driving the design of the world's most complex networks powered by silicon that carries over 90% of IP traffic. You will be an avid learner, eager to learn and process new technologies and rules, and excel in documenting and communicating critical information to the team.

Minimum Qualifications:

Bachelor's in Mechanical Engineering or related field, or equivalent experience

8 or more years of experience in the industry with IC Package or PCB development

Experience with several high pin count, high-power and high-speed packages or equivalent PCBs and leading them to production

Experience with fabrication and assembly design rules both for package as well as board

Experience with assembly and package layout standards

Experience in designing fully integrated mechanical solutions

Knowledge of packaging materials and material properties

Preferred Qualifications:

Master's degree in Mechanical Engineering

Knowledge of Icepak and Flotherm

Knowledge of mechanical simulation tools, Ansys Mechanical

Experience with mechanical and thermal analysis and familiarity with lab equipment used for material characterization and failure analysis

Familiarity and Interest in Advanced package layout with multiple die and non-symmetric layout

Experience with Thermal modeling and simulation a plus

Cisco is an Affirmative Action and Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.

Cisco will consider for employment, on a case by case basis, qualified applicants with arrest and conviction records.